Product Announcement: K1-F6 Casing Upgrade
2025-09-02
PV:113
Dear Customers and Partners,
We are delighted to note that our F6 product has long been a hit in the market. In performance and design, it not only meets the core needs of the POS (Point of Sale) and self-service terminal industries but also works well for more application scenarios across sectors.
Upgrading:
The flat part of the front shell is changed to an ice-spike design to increase 36.4% heat dissipation area.
To further enhance its operational stability and practicality, we have recently upgraded the F6’s casing—focusing on optimizing heat dissipation. While keeping the product’s overall size, interface configuration, and wall-mounting method completely unchanged, we increased the heat sink area on the front shell. This upgrade not only makes the product more refined and durable during continuous operation but also ensures seamless compatibility with your existing application scenarios.
Note: This upgrade only adjusts the front shell design for improved heat dissipation; the product’s overall size and internal motherboard structure remain identical, with no impact on the use of existing supporting equipment.
For more details about the upgrade or further inquiries, please contact us via the official website customer service channel.